SY55858UHI |
RFQ for SY55858UHI |
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| Technical/Catalog Information | SY55858UHI |
| Vendor | Micrel Inc |
| Category | Integrated Circuits (ICs) |
| Type | Crosspoint Switch |
| Voltage Supply Source | Single Supply |
| Voltage - Supply, Single/Dual (±) | 2.3 V ~ 3.6 V |
| Circuit | 2 x 2:2 |
| On-State Resistance | - |
| Mounting Type | Surface Mount |
| Package / Case | 32-TQFP |
| Packaging | Tray |
| Current - Supply | 150mA |
| Operating Temperature | -40°C ~ 85°C |
| Function | Crosspoint Switch |
| Drawing Number | * |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | SY55858UHI SY55858UHI |
| Product | Manufacturers | Pack | D/C |
| SY55858UHI | - | 03+ | TQFP/32 |
The SY55858U is a low-voltage, high-speed dual 2 x 2 crosspoint switch with a flexible input that accepts CML or PECL, and a 50 compatible differential CML (currentmode logic) output. The non-blocking design allows any input to connect to any output. Varying the state of the select inputs allows SY55858U to be used in backup, fault tolerant, protection and backplane distribution applications.
The signal inputs (DA01 and DB01) have a unique internal termination design that allows access to the termination network through VT pins. This feature allows the device to easily interface to other logic standards such as AC-coupled or DC-coupled PECL/LVPECL signals. For applications that require a single-channel 2 x 2 crosspoint, consider the SY55854.
Typical Application |
Features |
| · SONET/SDH optical transport· Backplane redundancy· Add-drop Multiplexers | ` Guaranteed AC parameters over temperature:• fMAX > 3.0GHz (3Gbps)• tr/ tf < 120ps• Within-device skew < 25ps` Non-blocking "switch architecture"` Configurable as dual 2:1 mux, dual 1:2 fanout buffer, 1:4 fanout buffer, quad buffer, or dual 2 x 2 switch` 50 compatible outputs` Unique input termination and VT pin for DC-coupled and AC-coupled input signalsCML or PECL` Fully differential inputs/outputs` TTL/CMOS compatible control logic` Wide supply voltage range: 2.3V to 3.6V` Wide operating temperature range: 40°C to +85°C` Available in 32-pin EPAD-TQFP package |
| Symbol | Rating | Value | Unit |
| VCC | Power Supply Voltage | 0.5 to +6.0 | V |
| VIN | Input Voltage (VCC = 0V, VIN not more negative than VEE) Input Voltage (VEE = 0V, VIN not more positive than VCC) |
0.5 to VCC +0.5 | V V |
| IOUT | Output Current Continuous Surge |
VCC 1.0 to VCC +0.5 | mA |
| TLEAD | Lead Temperature (soldering, 20sec.) | +260 | °C |
| TA | Operating Temperature Range | 40 to +85 | °C |
| Tstore | Storage Temperature Range | 65 to +150 | °C |
| JA | Package Thermal Resistance Still-Air (SOIC) (Junction-to-Ambient) 500lfpm (SOIC) |
28 20 |
°C/W °C/W |
| JC | Package Thermal Resistance (SOIC) (Junction-to-Case) (MSOP) |
4 | °C/W |